发明名称 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK |
摘要 |
Embodiments of the present invention relate to forming semiconductor device package with a heat sink. In one embodiment, a subassembly comprising a die attached to a lead frame is formed, a heat sink is provided in a molding cavity, and the subassembly is coupled to the heat sink while the heat sink is in the molding cavity. In certain embodiments, a second component of the lead frame can be substituted for the heat sink. Such techniques can simplify the manufacturing process for semiconductor packages having a heat sink or lead frame with a second component. |
申请公布号 |
US2013017652(A1) |
申请公布日期 |
2013.01.17 |
申请号 |
US201213348332 |
申请日期 |
2012.01.11 |
申请人 |
GEM SERVICES, INC.;TSUI ANTHONY C.;YANG HONGBO;ZHOU MING;CHU WEIBING;CHIA ANTHONY |
发明人 |
TSUI ANTHONY C.;YANG HONGBO;ZHOU MING;CHU WEIBING;CHIA ANTHONY |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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