An injection molding apparatus is provided. The injection molding apparatus includes a mold, a plate heater mounted to the mold to heat the mold, and a cooling passage provided above or below the plate heater.
申请公布号
WO2012161468(A3)
申请公布日期
2013.01.17
申请号
WO2012KR03892
申请日期
2012.05.17
申请人
SAMSUNG ELECTRONICS CO., LTD.;PYO, JIN SOO;LEE, JONG WON;CHO, JIN HYUN;KIM, JIN SUB
发明人
PYO, JIN SOO;LEE, JONG WON;CHO, JIN HYUN;KIM, JIN SUB
