| 摘要 |
<P>PROBLEM TO BE SOLVED: To substantially prevent transfer printing of a tape material to a rear surface of an electronic component and resolve the inconveniences that may be caused by the transfer printing of the tape material. <P>SOLUTION: A tape material 40 (for example, PTFE) is preheated and pressurised against a heat resistance plate 50. Then, an electronic component, which is attracted and held by a tool 36 with the heated tape material 40 disposed between the electronic component and the tool 36, is mounted by using heat crimping so that an electrode terminal of the electronic component is connected with an electrode terminal of a substrate through an insulative joining material. <P>COPYRIGHT: (C)2013,JPO&INPIT |
