| 摘要 |
Semiconductor manufacturing equipment having a plurality of nozzles and a method for controlling the nozzles are provided to reduce a processing time and increase productivity of the process by operating at least a couple of nozzles at the same time. Semiconductor manufacturing equipment comprises a chamber(102), a chuck plate(104), a plurality of nozzles, a driving units(122,132), and a control unit(106). The chamber is a space for performing a cleaning process. The chuck plate is installed within the chamber for loading a wafer thereon. The nozzles, that are fixed, rotated, and reciprocated, clean the wafer loaded on the chuck plate, comprising a first nozzle(110) horizontally reciprocating for discharging chemical liquid on a front surface of the wafer, second and third nozzles(120,130) generating supersonic wave on the front surface of the wafer, a fourth nozzle(140) fixed to one side of the chamber for discharging deionized water on the wafer, and a fifth nozzle(150) mounted on the chuck plate for discharging deionized water on a back surface of the wafer. At least the first and second, or first and third nozzles are operated at the same time by the control unit. The driving units drive the nozzles. The control unit operates at least a couple of nozzles at the same time in one recipe step, while the cleaning process is undergoing.
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