发明名称 Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive
摘要 A chip includes an integrated circuit and a carbonic layer. The carbonic layer includes a graphite-like carbon, wherein a lateral conducting path through the graphite-like carbon electrically connects two circuit elements of the integrated circuit.
申请公布号 US2013015583(A1) 申请公布日期 2013.01.17
申请号 US201113184346 申请日期 2011.07.15
申请人 INFINEON TECHNOLOGIES AG;HOECKELE UWE 发明人 HOECKELE UWE
分类号 H01L23/48;H01L21/768 主分类号 H01L23/48
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