| 摘要 |
The present invention relates to a structure of casing of electronic device, which includes a plurality of flexible wires and a plurality of plastic wires interlacing each other to form a plate. The plate is applied with a bonding agent and is subjected to hot pressing to consolidate and solidify the plate to form a casing having a predetermined shape. In the manufacturing process of the casing, hot pressing is applied to realize multiple times of processing. Further, the plate that is formed of the above described structure can effectively shorten the processing time and is also advantageous in being fireproof and heat resistant.
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