发明名称 WIRING BOARD INCORPORATING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING WIRING BOARD INCORPORATING ELECTRONIC COMPONENT
摘要 <p>A wiring board (10) has: a substrate (100), which has a first surface (F1), a second surface (F2) on the reverse side of the first surface (F1), a cavity (R10) that penetrates from the first surface (F1) to the second surface (F2), and a through hole (300a); and an electronic component (200) disposed in the cavity (R10). The through hole (300a) is configured by being filled with a conductor, a through hole conductor (300b) is formed of a first conductor portion that is tapered toward the second surface (F2) from the first surface (F1), and a second conductor portion that is tapered toward the first surface (F1) from the second surface (F2), and the first conductor portion and the second conductor portion are connected to each other in the substrate (100).</p>
申请公布号 WO2013008552(A1) 申请公布日期 2013.01.17
申请号 WO2012JP63956 申请日期 2012.05.30
申请人 IBIDEN CO., LTD.;SHIMIZU KEISUKE;MIKADO YUKINOBU;SAKAI SHUNSUKE;TOMIKAWA MITSUHIRO;FURUTANI TOSHIKI 发明人 SHIMIZU KEISUKE;MIKADO YUKINOBU;SAKAI SHUNSUKE;TOMIKAWA MITSUHIRO;FURUTANI TOSHIKI
分类号 H05K3/46;H01L23/12;H05K1/11 主分类号 H05K3/46
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