| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor chip for performing laser dicing of semiconductor wafer and obtaining two or more semiconductor chips, by using a dicing die-bonding tape, which is capable of picking up the semiconductor chip with die-bonding film easily after the dicing step. SOLUTION: A dicing die-bonding tape 1 equipped with a first dicing film 4 having light transmittance, which is 70% or more and smaller than 100% in wavelength of 300-400 nm, and die bonding film 3 stuck on one face of the first dicing film 4 is jointed with a semiconductor wafer 21. Then, irradiation of laser beam is performed from semiconductor wafer 21 side. The semiconductor wafer 21, along with the die bonding film 3, is subjected to dicing and is separated into each semiconductor chip so that the semiconductor chip is taken out in this manufacturing method of the semiconductor chip. COPYRIGHT: (C)2008,JPO&INPIT |
