| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device packaged by bonding of a cover member to on a semiconductor element, which inhibits occurrence of cracks in the semiconductor element to improve yield. <P>SOLUTION: A semiconductor device 1 in which a cover member 4 is bonded to on a semiconductor element 2 via a ring-shaped seal member 3, comprises a seal member 3 formed in a shape such that an inner periphery varies in a stepwise fashion from the semiconductor element 2 toward the cover member 4. When an external force pressing the semiconductor device from the semiconductor element 1 side to the cover member side is applied, by forming the internal periphery so as to vary in a stepwise fashion in a vertical direction with respect to a surface of the semiconductor element 1, stress applied to the semiconductor element 1 is relaxed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
