发明名称 SOLID-STATE IMAGE PICKUP DEVICE AND SOLID-STATE IMAGE PICKUP DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device and a solid-state image pickup device manufacturing method, which can improve element isolation characteristics. <P>SOLUTION: A solid-state image pickup device manufacturing method according to an embodiment comprises an element isolation region formation process and a charge storage region formation process. In the element isolation region formation process, an element isolation region isolating photoelectric conversion elements from each other is formed by epitaxial growth of a first conductivity type semiconductor layer. In the charge storage region formation process, a charge storage region in the photoelectric conversion element is formed by epitaxial growth of a second conductivity type semiconductor layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013012574(A) 申请公布日期 2013.01.17
申请号 JP20110144060 申请日期 2011.06.29
申请人 TOSHIBA CORP 发明人 WATANABE RYUTA
分类号 H01L27/146;H01L21/761 主分类号 H01L27/146
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