| 摘要 |
A printed circuit board (PCB) having heat gathering structures is used for enabling electronic components with pins to be inserted thereon. The PCB includes a base, at least one insertion hole, and at least one heat gathering hole. The base has a first surface and a second surface. The insertion hole penetrates the base, and the base has soldering pad on the periphery of the insertion hole. A first electric conducting layer is disposed on the inner wall of each insertion hole. The heat gathering hole penetrates the base. A second electric conducting layer is disposed on the inner wall of each heat gathering hole. The temperature of the insert holes will be increased for improving soldering process. A manufacturing process of the PCB having heat gathering structures is also disclosed.
|
