| 摘要 |
#CMT# #/CMT# The package (10) has a group of components (30) arranged on a substrate (20) e.g. plate, and a solder pad (23) fixed to the substrate opposite to the group. A frame (60) e.g. grid, is prearranged on the substrate, and a peripheral shield (61) is arranged on the substrate around the group. An insulating material (40) seals the group, defines a tunnel (41), and is constituted of a molding compound. An upper shield (50) is pre-arranged on the insulating material, and has a column (51) inserted through the tunnel and connected to the solder pad. The shields are metal coatings. #CMT# : #/CMT# The peripheral shield and the upper shield are produced by cathode sputtering. #CMT#USE : #/CMT# Micro-electromechanical system package for forming a semiconductor. #CMT#ADVANTAGE : #/CMT# The micro-electromechanical system package with the insulating material protects components of the package against humidity, which is caused by temperature variations. The upper shield is pre-arranged on the insulating material so as to protect the component group against electromagnetic interferences. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a cross sectional view of a micro-electromechanical system package. 10 : Micro-electromechanical system package 20 : Substrate 23 : Solder pad 30 : Component group 40 : Insulating material 41 : Tunnel 50 : Upper shield 51 : Column 60 : Frame 61 : Peripheral shield. |
