发明名称 |
Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine |
摘要 |
It is an object of the present invention to provide a wafer release method capable of releasing a wafer safely, simply and certainly and improving a wafer releasing rate, a wafer release apparatus and a wafer release transfer machine using the wafer release apparatus. A wafer release method of the present invention comprises the steps of: pressing the uppermost wafer along an axis direction (L-L') shifted by an angle in the range of from 15 to 75 degrees from a crystal habit line axis (A-A') or (B-B') of the uppermost wafer clockwise or counterclockwise; bending upwardly the peripheral portion of the uppermost wafer so as to cause a bending stress in the uppermost wafer in the axis direction (L-L') shifted by the angle; blowing a fluid into a clearance between the lower surface of the uppermost wafer and the upper surface of the lower wafer adjacent thereto; and raising the uppermost wafer for releasing.
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申请公布号 |
US7364616(B2) |
申请公布日期 |
2008.04.29 |
申请号 |
US20050554371 |
申请日期 |
2005.10.25 |
申请人 |
MIMASU SEMICONDUCTOR INDUSTRY CO. LTD |
发明人 |
TSUCHIYA MASATO;MASHIMO IKUO;SAITO KOICHI |
分类号 |
H01L21/68;B65H3/08;B65H3/48;H01L21/00;H01L21/683 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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