发明名称 MULTILAYER SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer substrate which suppresses interference of signals, can be thinned, and is capable of obtaining desired characteristic impedance. <P>SOLUTION: The multilayer substrate of the present invention, in which a plurality of insulating layers and a plurality of conductor layers are laminated, comprises: a core 10 which is the thickest of the conductor layers and functions as ground wiring; and signal wiring 14a which is included in the conductor layers and is adjacent to the core 10 via an insulating layer 22 and through which a high-frequency signal flows. A recess 10a is provided in that region of the core 10 which faces the signal wiring 14a. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013012699(A) 申请公布日期 2013.01.17
申请号 JP20110233277 申请日期 2011.10.24
申请人 TAIYO YUDEN CO LTD 发明人 SAJI TETSUO;NISHIMURA HIDENORI;TASAKA NAOYUKI
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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