发明名称 |
BOND PAD CONFIGURATIONS FOR SEMICONDUCTOR DIES |
摘要 |
A semiconductor device is provided and includes a semiconductor die, and a plurality of bond pads having exposed surfaces arranged in an alternating interleaved pattern on the semiconductor die. Each of the surfaces of the bond pads have a first bond placement area that overlaps with a second bond placement area, with the first bond placement area having a major axis that is orthogonal to a major axis of the second bond placement area. A connecting bond is located at an intersection of the major axes of the first bond placement area and the second bond placement area on one or more of the bond pads.
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申请公布号 |
US2013015592(A1) |
申请公布日期 |
2013.01.17 |
申请号 |
US201113325764 |
申请日期 |
2011.12.14 |
申请人 |
INTERSIL AMERICAS INC.;KELKAR NIKHIL VISHWANATH;PUSHPALA SAGAR;ANKIREDDI SESHASAYEE SS. |
发明人 |
KELKAR NIKHIL VISHWANATH;PUSHPALA SAGAR;ANKIREDDI SESHASAYEE SS. |
分类号 |
H01L23/498;H01L21/283;H01L21/60 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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