| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulating adhesive film that has low linear expansion, is excellent in wiring-embedding properties, and has high peeling strength. <P>SOLUTION: The insulating adhesive film comprises: a layer to be plated, which consists of a resin composition for the layer to be plated, the resin composition including an alicyclic olefin polymer (A1) having a polar group, and an inorganic filler (A2); and an adhesive layer that consists of a resin composition for the adhesive layer, the resin composition containing an organic solvent-soluble polyimide (B) and an inorganic filler (B2). <P>COPYRIGHT: (C)2013,JPO&INPIT |
