ELECTRONIC ASSEMBLY INCLUDING DIE ON SUBSTRATE WITH HEAT SPREADER HAVING AN OPEN WINDOW ON THE DIE

摘要

An electronic assembly (150) includes a workpiece (110), a through substrate via (TSV) die (120) including a substrate (105) and a plurality of TSVs (115), a topside (121) and a bottomside (122) having TSV connectors (113) thereon. The TSV die is attached to the workpiece with its topside on the workpiece. A heat spreader (130) having an inner open window (131) is on the bottomside of the TSV die. Bonding features (161) are coupled to the TSV connectors or include the TSV connectors themselves. The bonding features protrude from the inner open window to a height above a height of the top (132) of the heat spreader that allows a top die to be bonded thereto.