| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which a chip can be picked up satisfactorily without leaving a trace of a push-up pin and causing a chip crack. <P>SOLUTION: A dicing die bonding adhesive film comprises: a sticker layer 2 laminated on at least one surface of a substrate layer 1; and an adhesive layer 3 laminated on the sticker layer 2. Young's modulus of the adhesive layer 3 of the adhesive film at 25°C is 100 MPa or over and a 180 degree peel force for removal of the sticker layer 2 from the adhesive layer 3, which is measured at peel speed of 300 mm/minute, is 0.05 to 0.7 N/25 mm. The upthrust is exerted using four or more upthrust pins, which means that an area per one pin is 70 mm<SP>2</SP>or less, while diameter is≥0.5 mm. The shape of the front end of the pin is flat or an arc with a radius of≥200μm. The push-up speed is 1 to 15 mm/sec and the amount of push-up is 200 to 1,000μm. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
