| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate polishing device and substrate polishing equipment by which a treatment liquid having a strong corrosion behavior and toxic properties and gas generated by vaporizing the liquid are totally prevented from scattering to the outside of the device, and further a substrate can be efficiently polished with a high degree of accuracy. SOLUTION: The substrate polishing device includes a polishing table 11 and a substrate holding mechanism 12. A polishing treatment liquid is supplied to the upper surface of the polishing table 11, and further a substrate is held by the substrate holding mechanism 12, and brought into contact with the catalytic surface of the polishing table 11 by predetermined pressure, or immersed in the treatment liquid to approximate or contact with the polishing table 11 surface, and thereby the substrate is polished by the relative movement of the substrate and the polishing table 11. Outsides of the substrate holding mechanism 12 and the polishing table 11 are covered with a capsule to prevent the treatment liquid and its volatile gas and the like from scattering to the outside. COPYRIGHT: (C)2008,JPO&INPIT |
