| 摘要 |
A lead frame for a semiconductor package is provided to reduce bonding and mold flash during semiconductor packaging by connecting a lead to a side rail and firmly supporting a lead. A lead frame for a semiconductor package includes an inner lead(250), an outer lead(260), a side rail(210), a dam bar(240), and a tie bar(230). The inner lead is electrically connected to an electrode of a semiconductor chip. The outer lead extends from the inner lead. The side rail temporarily fixes the outer lead. The side rail is connected to an end of the outer lead. The dam bar is formed to be integrated with the side rail, and blocks external flow of resin during molding. The dam bar is connected to four corners of a chip mounting plate(220) on which the semiconductor chip is mounted. The tie bar holds the chip mounting plate. |
