| 摘要 |
In a photodetecting device 3, a wiring board 12 is provided at the front surface side of a photodetecting element 11 so that a first bonding pad region 15 formed on the front surface of the photodetecting element 11 is exposed, and second bonding pads 17B are formed, of the wiring board 12, in the region on a further inner side than first bonding pads 17A. Thereby, in the photodetecting device 3, a forming space for wire bonding can be located at the inside of the photodetecting element 11, so that the wiring board 12 and the photodetecting element 11 can be made almost equal in size. As a result, in the photodetecting device 3, the area that the photodetecting element 11 occupies relative to the photodetecting device 3 can be sufficiently secured, and minimization of the non-sensitive region in the case of a buttable arrangement of the photodetecting devices 3 on a cold plate 2 can be realized. |
