| 摘要 |
<p>In a heat-generating component, such as electronic equipment having a heat-generating component mounted on a circuit board or the like, an assembled battery, or a heat-generating machine component, heat generated from the heat-generating component is efficiently dissipated, and the transfer of heat to a component to be protected, adjacent to the heat-generating component, is suppressed, thereby preventing a decrease in performance, and the like, due to the component to be protected being heated. Therefore, the present invention is a heat insulation/heat dissipation sheet comprising a pressure-sensitive adhesive layer or a heat-conducting pressure-sensitive adhesive layer, a heat-conducting layer, a pressure-sensitive adhesive layer or a heat-insulating pressure-sensitive adhesive layer, a heat-insulating layer, and a pressure-sensitive adhesive layer or a heat-insulating pressure-sensitive adhesive layer laminated in order between the heat-generating component and the component to be protected, adjacent to the heat-generating component, for connecting the components. Further, the present invention is an intra-device structure comprising the heat insulation/heat dissipation sheet with the pressure-sensitive adhesive layer on a heat-conducting layer side thereof adhered to a heat-generating component side and the pressure-sensitive adhesive layer on a heat-insulating layer side thereof adhered to a component to be protected.</p> |
