发明名称 APPARATUS FOR PROCESSING SUBSTRATE
摘要 PURPOSE: A substrate processing apparatus is provided to improve a substrate processing speed using resonant plasma with ion energy and plasma density. CONSTITUTION: A chamber(100) includes an inner space which processes a substrate(S). A first shower head(310) and a second shower head(320) are arranged on the upper side of a substrate support unit(200) and spray source gas. A plasma generating tube(510) passes through the first shower head and the second shower head. An antenna(520) is wound around the outer side of the plasma generating tube. A magnetic field generating unit(600) is installed in the inner side or the outer side of the chamber. [Reference numerals] (AA) Second plasma area; (BB) First plasma area
申请公布号 KR20130005841(A) 申请公布日期 2013.01.16
申请号 KR20110067481 申请日期 2011.07.07
申请人 CHARM ENGINEERING CO., LTD. 发明人 LEE, KEE SU;HAN, YOUNG KI;CHOI, JAE CHUL
分类号 H01L21/205;H01L21/3065 主分类号 H01L21/205
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