| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a copper clad laminated sheet, from which the defect of low adhesion strength and the transparency inferiority of a polyimide film remaining after a copper foil is removed by etching, not eliminated heretofore in a copper clad laminated sheet for a substrate is eliminated and which is suitable as an all-polyimide substrate material. <P>SOLUTION: The copper clad laminated sheet is formed by laminating the polyimide film and low roughness copper foil, and light transmittance is set to 40% or more in a wave length of 600 nm of the film after etching the copper foil, and a haze value is set to 30% or less, and the bonding strength is set to 500 N/m or more. The copper-clad laminate is formed by laminating the polyimide film and a copper layer. The light transmittance in the wave length of 600 nm of the film after etching the copper layer is set to 40% or more, and the haze value is set to 30% or less, and the bonding strength is set to 500 N/m or more, and the binding strength after heat treatment for 1000 hours at 150°C is set to 285 N/m or more. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
