| 摘要 |
An apparatus for treating substrate and method for treating substrate using the same are provided to improve the throughput of substrate treatment by compactly disposing the substrate processing unit through the whole substrate. The substrate positioned outside the processing chamber is moved to the inside of the processing chamber through door by using the robot transfer arm. The substrate is mounted in the substrate mounting unit of the processing chamber. Fluid injection units(151a, 151b) generate the plasma. The plasma is emitted to the substrate through the fluid injection hole(120). The ashing uniformity is improved by rotating substrate. The ashing efficiency is improved by respraying the plasma to the substrate.
|
