Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof

摘要

A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps:
- providing a layer of rigid insulating material (1)
- removing at least one area of the rigid insulating material
- inserting a flexible insulating material (3) into the removed or cut-out area(s) of the rigid insulating material (1)
- covering the rigid and flexible insulating material (1, 3) with a layer (4) of conductive material on at least one surface
- building up at least one further layer (5, 6, 7, 8) of the rigid-flex printed circuit board (10) at least on the rigid part(s) of the insulating material. Furthermore a rigid-flex printed circuit board (10) or sub-assembly thereof is provided.