| 摘要 |
PURPOSE: A rapid heating device is provided to reduce heating time by arranging a heating device along a supply line which supplies an etchant to an etching unit to rapidly heat the etchant. CONSTITUTION: An etchant chamber(112) receives an etchant. A first etching unit(130a), a second etching unit(130b), and a third etching unit(130c) etch a wafer. A supply line(114) is connected to the first to third etching units in the etchant chamber. An etchant supply pump(119) pumps the etchant from the etchant chamber to the first to third etching units. A heating unit(116,118) maintains the temperature of the etchant supplied from the first to third etching units with a preset temperature. [Reference numerals] (112) Etchant chamber; (130a) First etching unit; (130b) Second etching unit; (130c) Third etching unit
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