发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a sheet for sealing an optical device, which can provide an optical semiconductor device having excellent luminance retention, low sealable temperature at which a wire connected to the optical semiconductor chip does not break, and a small coefficient of sheet extension, namely, satisfactory resistance to reflow, under high temperature after sealing. <P>SOLUTION: The sheet for sealing an optical semiconductor device contains an acryl-based polymer having a functional group and a cross-linking agent composed of an epoxy resin or an acid anhydride, wherein the functional group is one or more selected from the group consisting of carboxyl group, epoxy group, and hydroxyl group. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5123031(B2) 申请公布日期 2013.01.16
申请号 JP20080102779 申请日期 2008.04.10
申请人 发明人
分类号 H01L33/56;C08G59/40;C08J5/18;H01L23/29;H01L23/31;H01L33/48;H01L33/62 主分类号 H01L33/56
代理机构 代理人
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