| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has excellent resolution and with which pattern rectangularity is not deteriorated even in a subsequent step of post baking in pattern formation with low exposure (in particular, less than 200 mJ/cm<SP>2</SP>). <P>SOLUTION: The photosensitive resin composition contains: a resin; an oxime-based photopolymerization initiator; an ultraviolet absorber; and a monomer which has an aromatic ring and of which the content in the total solid is 30 mass% or more, and is used for pixel formation in a solid imaging element. <P>COPYRIGHT: (C)2010,JPO&INPIT |
