| 摘要 |
A method of manufacturing a card including an electronic module by providing a frame or a plate having at least one aperture for receiving the electronic module. At least one part of the peripheral area of the aperture is deformed or crushed by localized application of pressure, so as to reduce locally the thickness of the frame or plate in the peripheral area. The electronic module is brought opposite the corresponding aperture so a zone of the electronic module is superposed on a part of the peripheral area, and a material connection is established between the part of the peripheral area and the corresponding zone of the electronic module for assembling the electronic module to the frame or plate before a resin is subsequently added to at least one side of the electronic module. |
