发明名称 |
PRINTED CIRCUIT BOARD FOR CAMERA MODULE AND CAMERA MODULE USING THE SAME |
摘要 |
A printed circuit board for a camera module and the camera module using the same are provided to form a ventilation hole for discharging air to the outside on an upper part of a substrate, thereby preventing deformation/damage of an image sensor. A substrate for a camera module(110) is formed in rectangular plate shape. In an upper girth of the substrate for a camera module, a plurality of upper pads(111) is formed. In rectangular outsides of the substrate, a plurality of side pads(112) is formed. A component mount groove(113) having a predetermined depth is formed to mount a plurality of electronic components(120). A ventilating hole(115) discharges air inside the component mount groove to the outside.
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申请公布号 |
KR20090089558(A) |
申请公布日期 |
2009.08.24 |
申请号 |
KR20080014791 |
申请日期 |
2008.02.19 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, BYUNG JAE;JANG, JIN BOK |
分类号 |
H04N5/225 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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