发明名称 PRINTED CIRCUIT BOARD FOR CAMERA MODULE AND CAMERA MODULE USING THE SAME
摘要 A printed circuit board for a camera module and the camera module using the same are provided to form a ventilation hole for discharging air to the outside on an upper part of a substrate, thereby preventing deformation/damage of an image sensor. A substrate for a camera module(110) is formed in rectangular plate shape. In an upper girth of the substrate for a camera module, a plurality of upper pads(111) is formed. In rectangular outsides of the substrate, a plurality of side pads(112) is formed. A component mount groove(113) having a predetermined depth is formed to mount a plurality of electronic components(120). A ventilating hole(115) discharges air inside the component mount groove to the outside.
申请公布号 KR20090089558(A) 申请公布日期 2009.08.24
申请号 KR20080014791 申请日期 2008.02.19
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, BYUNG JAE;JANG, JIN BOK
分类号 H04N5/225 主分类号 H04N5/225
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