| 发明名称 |
Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same |
| 摘要 |
A size reduced solid-state imaging apparatus may be provided. The solid-state imaging apparatus may include a wiring substrate having a body having a cavity on an area which a semiconductor chip may be mounted, a lead that may project inward into the cavity from the internal side of the body, and/or a tie bar.
|
| 申请公布号 |
US7579583(B2) |
申请公布日期 |
2009.08.25 |
| 申请号 |
US20040976792 |
申请日期 |
2004.11.01 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MOK SEUNG-KON;RO YOUNG-HOON |
| 分类号 |
H01J40/14;H01L27/14;H01L23/00;H01L23/12;H01L23/50;H01L27/00;H01L27/146;H01L31/0203;H01L31/0232;H04N5/225;H04N5/335;H04N101/00 |
主分类号 |
H01J40/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
