发明名称 CERAMIC SINTERED COMPACT, CIRCUIT BOARD USING THE SAME, ELECTRONIC DEVICE AND THERMOELECTRIC CONVERSION MODULE
摘要 <p>[Problem] There are provided a ceramic sintered body with superior thermal conductivity as well as high rigidity, a circuit board that does not crack easily, a highly reliable electronic device and a highly reliable thermoelectric conversion module. [Solution] A ceramic sintered body with superior thermal conductivity as well as high rigidity may be obtained by having a main crystalline phase predominantly composed of silicon nitride, and a grain boundary phase predominantly composed of magnesium oxide and rare-earth oxide, the grain boundary phase containing a component which is expressed in compositional formula form as: REMgSi 2 O 5 N, where RE represents rare-earth metal. Furthermore, when the ceramic sintered body is used in a circuit board, the circuit board does not crack easily and a highly reliable circuit board may be formed. An electronic device and thermoelectric conversion module that use this circuit board may be made highly reliable.</p>
申请公布号 EP2546216(A1) 申请公布日期 2013.01.16
申请号 EP20110753404 申请日期 2011.03.09
申请人 KYOCERA CORPORATION 发明人 ISHIMINE,YUUSAKU;MORIYAMA,MASAYUKI;KOMATSUBARA,KENJI;NAKAO,YUUYA
分类号 C04B35/584 主分类号 C04B35/584
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