| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a multilayer wiring board capable of providing reliable interlayer electrical connection by remarkably improving connection reliability between a wiring pattern and an interlayer connection material. SOLUTION: When manufacturing a multilayer wiring board, conductive wires 13 each formed of a predetermined conductive material is driven from the side of an insulation layer formation material 12 within a base material with the insulation layer formation material 12 stuck to one surface of a conductive layer formation material 11, and the conductive wires 13 are inserted until contacting the conductive layer formation material 11. Then, when manufacturing the multilayer wiring board, a conductive layer formation material 14 is laminated on a surface of the insulation layer formation material 12, and shape forming is carried out so that contact parts between the conductive layer formation materials 11, 14 and the conductive wires 13 form metallic connection. COPYRIGHT: (C)2010,JPO&INPIT |
