发明名称 CURABLE COMPOSITION AND PATTERN-FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a curable composition having an excellent performance in thin film coating to a substrate and in adhesion to the substrate, and being used for transferring a micro pattern to the substrate; and a pattern-forming method using the same. SOLUTION: The curable composition includes: an oligomer (A) having one or more ethylenically unsaturated group in its molecule and an average molecular weight of 1,000-30,000; an ethylenically unsaturated compound (B) with a homopolymer having Tg of 5°C or less, other than (A); an compound (C) having two or more ethylenically unsaturated groups in its molecule, other than (A) and (B); and an organic solvent (D) having a boiling point within a range of 115-175°C under atmospheric pressure. The concentration of an effective component other than the organic solvent is within a range of 0.1-10 mass%. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010018644(A) 申请公布日期 2010.01.28
申请号 JP20080177721 申请日期 2008.07.08
申请人 MITSUBISHI RAYON CO LTD 发明人 FUJIMOTO JUICHI;HAYAMA YASUSHI
分类号 C08F290/06 主分类号 C08F290/06
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