| 摘要 |
<p>PURPOSE: A power electronic system including a cooling device is provided to increase durability and thermal load by compensating mechanical load induced by heat. CONSTITUTION: A sub module(16) is connected to a cooling device(14) by a connection layer and includes a power diode(106), a first planar insulator(160), and a first conductive track(162). The sub module is connected to the cooling device by a close adhesion method or forced locking method. The first planar insulator is made of ceramic materials. An inner connection device(30) is composed of electric conductive layers(310,332) and an electric insulation layer(320).</p> |
