| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To keep paste characteristics of an adhesive agent as much as possible and improve thermoconductive characteristics of the adhesive agent, in an electronic device wherein a heat generating part and a heat sink are mechanically and thermally joined via an adhesive agent containing a thermoconductive filler. <P>SOLUTION: The adhesive agent 30 includes: a first area 30a wherein a thermoconductive filler 32 densely exist in a plane crossing orthogonally its thickness direction; and a second area 30b wherein the thermoconductive filler 32 exists more sparsely than the first area 30a. The first area 30a is located immediately under a heat generating part 11 that produces a largest amount of heat among the heat generating components 10 when the components 10 are driven, and the second area 30b is provided around the outer periphery of the first area 30a. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
