Memory device formed with a semiconductor interposer

摘要

A packaged memory device includes a semiconductor interposer, a first memory stack, a second memory stack, and a buffer chip that are all coupled to the semiconductor interposer. The first memory stack and the second memory stack each include multiple memory chips that are configured as a single stack. The buffer chip is electrically coupled to the first memory stack via a first data bus, electrically coupled to the second memory stack via a second data bus, and electrically coupled to a processor data bus that is configured for transmitting signals between the buffer chip and a processor chip. Such a memory device can have high data capacity and still operate at a high data transfer rate in an energy efficient manner.

主权项

1. A packaged memory device comprising:
a semiconductor interposer; a first memory stack that is coupled to the semiconductor interposer and includes a first plurality of memory chips configured as a single stack; a second memory stack that is coupled to the semiconductor interposer and includes a second plurality of memory chips configured as a single stack; and a buffer chip that is coupled to the semiconductor interposer, coupled to the first memory stack via a first data bus, coupled to the second memory stack via a second data bus, and coupled to a processor data bus that is configured for transmitting signals between the buffer chip and a processing unit.