THIN FILM FORMING METHOD AND THIN FILM FORMING APPARATUS

摘要

PURPOSE: A method and apparatus for forming a thin film are provided to harden thin film materials attached to a substrate without the deterioration of a throughput by separately performing a temporary hardening process and a main hardening process. CONSTITUTION: A lifter(31,32) is guided by a linear guide(30) and moves in an x direction. A stage(55) is received in a first thin film material discharge station(23). The stage is guided by a linear guide(56) and moves in a y direction cross the x direction. The lifter moves to the first thin film material discharge station to load a substrate(40) on the stage. A nozzle head unit(57) is supported by a support member(58).