| 摘要 |
This invention provides an adhesive tape for semiconductor wafer processing which can reduce the wafer warpage, pits on wafer back sides, the paste residue or surface contamination on surface electrodes of wafers and realize the wafer thin film cutting and grinding. The adhesive tape for semiconductor wafer processing contains at least one low elastic modulus layer on a single side surface of a high elasticity substrate film and a radiation-curable adhesive layer on the low elastic modulus layer. The high elasticity substrate film has a Young's modulus of 5.0×10 <SP> 8 </SP> Pa to 1.1×10 <SP> 10 </SP> Pa. The low elastic modulus layer has an elastic modulus under 25 DEG C G'(25 DEG C) of 2.5×10 <SP> 5 </SP> Pa to 4.0×10 <SP> 5 </SP>Pa and an elastic modulus under 60 DEG C G'(60 DEG C) of 0.2×10 <SP> 5 </SP> Pa to 1.5×10 <SP> 5 </SP> Pa, wherein the ratio G'(60 DEG C)/G'(25 DEG C) is 0.5 or less. The low elastic modulus layer has a loss tangent under 25 DEG C tanδ(25 DEG C) of 0.08 to 0.15 and a ratio tanδ(60 DEG C)/tanδ(25 DEG C) to the loss tangent under 60 DEG C tanδ(60 DEG C) of 4.0 or above; in addition, the radiation-curable adhesive layer has a thickness of 5 to 100 micron, and the thickness of the radiation-curable adhesive layer/ thickness of the low elastic modulus layer less than 1/2. |
