| 摘要 |
Provided is a circuit module reduced in size. The circuit module includes: a substrate to which electronic parts are mounted; a shield case; and a bonding material for bonding the substrate and the shield case. The shield case includes legs extending from given side walls of the shield case to overlap with portions of the side faces of the substrate, and the portions of the side faces of the substrate are bonded to the legs of the shield case by the bonding material. The shield case includes openings formed in the given side walls of the shield case to expose overlapping portions where the portions of the side faces of the substrate overlap with the legs of the shield case. |
