发明名称 |
SOCKET WITH ROUTED CONTACTS |
摘要 |
A socket (130) employs a substrate (310) including a conductive network. An array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a routed first contact (136′) that the conductive network routes horizontally in or on the substrate (310). |
申请公布号 |
US2016172773(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
US201615053412 |
申请日期 |
2016.02.25 |
申请人 |
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
发明人 |
Leigh Kevin;Megason George |
分类号 |
H01R12/70 |
主分类号 |
H01R12/70 |
代理机构 |
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代理人 |
|
主权项 |
1. A socket interposer, comprising:
a substrate; a first set of contacts on a top surface of the substrate to interface with an integrated circuit; a second set of an exposed portion of the top surface of the substrate; and a set of traces, each trace connecting a contact of the first set contact and a contact of the second set. |
地址 |
Houston TX US |