发明名称 SOCKET WITH ROUTED CONTACTS
摘要 A socket (130) employs a substrate (310) including a conductive network. An array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a routed first contact (136′) that the conductive network routes horizontally in or on the substrate (310).
申请公布号 US2016172773(A1) 申请公布日期 2016.06.16
申请号 US201615053412 申请日期 2016.02.25
申请人 HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP 发明人 Leigh Kevin;Megason George
分类号 H01R12/70 主分类号 H01R12/70
代理机构 代理人
主权项 1. A socket interposer, comprising: a substrate; a first set of contacts on a top surface of the substrate to interface with an integrated circuit; a second set of an exposed portion of the top surface of the substrate; and a set of traces, each trace connecting a contact of the first set contact and a contact of the second set.
地址 Houston TX US