| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting structure which achieves improvement of thermal stress resistance and anti-shock characteristic and heat dissipation of a chip component mounted on a wiring board, and has excellent reliability and is usable even under high-temperature environment. <P>SOLUTION: The electronic component mounting structure includes: a chip component mounted on a circuit pattern of a circuit board; electrodes respectively disposed on both ends of the chip component; a heat transfer material disposed in an electronic component; and a cover that is contacted with the heat transfer material, and is fixed in parallel to the circuit pattern. The electrodes include a circuit bonding part and a vertical leg part. A total of a placement height of the electronic component and a thickness of the heat transfer material after the cover is fixed, is smaller than that before fixing the cover. <P>COPYRIGHT: (C)2013,JPO&INPIT |
