发明名称 半硬化物、硬化物およびそれらの製造方法、光学部品、硬化樹脂組成物ならびに化合物
摘要 A curable resin composition containing a compound of formula (1), a compound of formula (2) and a thermal- or photo-radical polymerization initiator is capable of producing a cured product having a low Abbe's number and capable of realizing burr reduction in molding the composition. Ar1 to Ar4 represent aryl or heteroaryl, at least one of Ar1 to Ar4 is aromatic condensed ring, and two or more of Ar1 to Ar4 have a polymerizable group, and at least one of R21 to R26 forms a ring, or at least two bond to each other to form a ring:
申请公布号 JP5940496(B2) 申请公布日期 2016.06.29
申请号 JP20130138415 申请日期 2013.07.01
申请人 富士フイルム株式会社 发明人 染谷 あゆみ;芳沢 昌孝;大林 達彦;内藤 寛之
分类号 C08F220/30;C07C69/54;C08F210/14;C08F216/12;C08F220/56;C08F236/20 主分类号 C08F220/30
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