| 摘要 |
According to the present invention, an evaporation source comprises: a crucible in which a deposition material is stored; a distribution pipe spraying the deposition material evaporated from the crucible; a heater heating the crucible; a cooling jacket to cool the heater; a lifting device moving the heater and the cooling jacket up and down; and a cooling means injecting cooling gas to the outside of the crucible to cool the evaporation source. Therefore, in a process to cool the evaporation source so as to open a chamber wherein a process is complete, cooling time can be shortened, and cooling efficiency can be improved, thereby improving productivity of a thin film deposition device. |
