ADHESIVE FILM FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor wafer that shows good handleability when supplied to a semiconductor wafer.SOLUTION: An adhesive film for a semiconductor wafer can be supplied to a semiconductor wafer with good handleability, where a glass-transition temperature (Tg) before curing is -20 to 30°C, and a rupture elongation at 10°C before curing is 3% or more and less than 300%.SELECTED DRAWING: None