| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting substrate, a manufacturing method thereof and an LED module capable of increasing heat dissipation and electrical reliability.SOLUTION: The mounting substrate 2 includes: a long heat exchanger plate 21 formed of a first metal plate for mounting LED chips 3 on one surface side thereof; a wiring pattern 22 formed of a second metal plate disposed at the opposite surface side of the heat exchanger plate 21 for electrically connecting to the LED chips 3; a long electrical insulation sheet 23 interposed between the heat exchanger plate 21 and the wiring pattern 22; and a resin part 28 embedding the wiring pattern 22, the insulation sheet 23 and the heat exchanger plate 21 and exposing the one surface side of the heat exchanger plate 21. The resin part 28 is electric insulation. The heat exchanger plate 21 includes first through holes 21b formed to allow wires 26 connecting the LED chips 3 and the wiring pattern 22 to pass therethrough. The electrical insulation sheet 23 is rigid and non-adhesive including a second through hole 23b formed to communicate with the first through hole 21b. |
