发明名称 SOUND INSULATION FLOOR STRUCTURE AND SOUND INSULATION FLOOR COMPONENTS AS WELL AS METHOD FOR REDUCING FLOOR IMPACT SOUNDS
摘要 <p>A sound insulation floor structure comprises a floor backing member, a floor finishing layer, and an intermediate layer between the floor backing member and the floor finishing layer, the intermediate layer comprising a buffer member comprising a nonwoven structure. The nonwoven structure comprises a thermal adhesive fiber under moisture which is melt-bonded to a fiber of the nonwoven structure to fix the fibers. For example, the sound insulation floor structure may comprise, in sequence, a floor backing member 1, a buffer layer 2, an air layer 3, a hard layer 4, and a floor finishing layer 5. In the floor structure, a support member 6 is disposed between the buffer layer 2 and the hard layer 4. The support member may occupy 10 to 70% of a floor area. The sound insulation floor structure prevents subsidence of a floor member due to walking, achieves comfortableness to walk, and has improved floor impact sound insulation.</p>
申请公布号 EP2546434(A1) 申请公布日期 2013.01.16
申请号 EP20110753267 申请日期 2011.03.03
申请人 KURARAY CO., LTD. 发明人 MIYAKE, NOBORU;TAKAMATSU, MASAHIKO;KANEZAKO, HIDEKI;HIRATA, KAZUTOSHI;HAYASHI, KOHEI;KIYOOKA, SUMITO;ADACHI, ATSUMI;KOIKE, MASARU;KOIZUMI, SATOSHI
分类号 E04F15/20;E04F15/18 主分类号 E04F15/20
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