发明名称 |
Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant |
摘要 |
A semiconductor package includes a post carrier having a base plate and plurality of conductive posts. A photosensitive encapsulant is deposited over the base plate of the post carrier and around the conductive posts. The photosensitive encapsulant is etched to expose a portion of the base plate of the post carrier. A semiconductor die is mounted to the base plate of the post carrier within the etched portions of the photosensitive encapsulant. A second encapsulant is deposited over the semiconductor die. A first circuit build-up layer is formed over the second encapsulant. The first circuit build-up layer is electrically connected to the conductive posts. The base plate of the post carrier is removed and a second circuit build-up layer is formed over the semiconductor die and the photosensitive encapsulant opposite the first circuit build-up layer. The second circuit build-up layer is electrically connected to the conductive posts.
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申请公布号 |
US8354304(B2) |
申请公布日期 |
2013.01.15 |
申请号 |
US20080329430 |
申请日期 |
2008.12.05 |
申请人 |
STATS CHIPPAC, LTD.;CHOW SENG GUAN;SHIM IL KWON;KUAN HEAP HOE;HUANG RUI |
发明人 |
CHOW SENG GUAN;SHIM IL KWON;KUAN HEAP HOE;HUANG RUI |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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