发明名称 |
Electronic device and method of manufacturing the same |
摘要 |
In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.
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申请公布号 |
US8354340(B2) |
申请公布日期 |
2013.01.15 |
申请号 |
US20070865745 |
申请日期 |
2007.10.02 |
申请人 |
RENESAS ELECTRONICS CORPORATION;KURITA YOICHIRO;KAWANO MASAYA;SOEJIMA KOJI |
发明人 |
KURITA YOICHIRO;KAWANO MASAYA;SOEJIMA KOJI |
分类号 |
H01L21/4763;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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